Thermal Management Materials (6005 Series)
Thermal Conductive Grease,
Heat Transfer Compound, Paste.
The 6005 Material – a heat sink compound formulated with select polydimethy siloxane fluid in combination with metallic oxide fillers to provide superior thermal conductivity.
This product is designed for use as a heat transfer compound in both the electrical and electronic industries. Characterized by high thermal conductivity, high dielectric constant, and high dissipation factor, the 6005 Heat Transfer Compound is an ideal product for use in power diodes, transistors, semi-conductors, and other applications that require these characteristics. The 6005 material exhibits excellent long-term storage stability without oil separation.
*High thermal conductivity *High dielectric constant *High dissipation factor
*Use with heat sinks or metal chassis *Will not dry or harden
6005 Material has a shelf-life of eighteen (18) months from the date of manufacture, as indicated by the lot number, when stored in the original unopened container at or below 26OC
|Specific Gravity||2.30 +/-0.2||g/cm3||ASTM D792|
|Volatile matter||<0.5% after 4h/200o C||oC||—|
|Bleed||No bleed after 4h/200oC||oC||—|
|Dielectric Strength||1.0KV @ 0.1mm||KV||ASTM D-149|
|Volume Resistivity||1×1014||Ohm-cm.||ASTM D-257|
|Thermal Conductivity||3.6||W/m-k||ASTM D5470|